High Thermal Conductivity Dual-Component Epoxy Encapsulating & Potting Compound
834HTC is a 2-part, black, rigid, flame-retardant thermal epoxy that provides extreme environmental, mechanical, and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and self-extinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
- Certified UL 746A (File# E334302)
- Flame-retardant-UL 94V-0 approved
- Low CTE
- Low exotherm
- High compressive and tensile strength
- Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulating characteristics
- Low shrinkage and high dimensional stability
- Non-halogenated flame-retardant fillers
- Solvent-free
Código PAC | C100327 |
---|---|
Modelo del fabricante | 834HTC |
Marca | MG Chemicals |
Cured Properties
- Resistivity: 3.0 x 1013Ω·cm
- Breakdown Voltage: 37,500 V
- Dielectric Strength: 395 V/mil
- Dissipation Factor @ 1 MHz: 0.02
- Dielectric Constant @ 1 MHz: 3.9
- Hardness: 91 D
- Tensile Strength: 22 N/mm2
- Compressive Strength: 123 N/mm2
- Lap Shear:
- Stainless Steel: 6.7 N/mm2
- Aluminum: 4.7 N/mm2
- Glass Transition Temperature (Tg): 117°C
- CTE Prior Tg: 34 ppm/°C
CTE After Tg: 116 ppm/°C - Thermal Conductivity @ 25°C: 0.9 W/(m·K)
- Service Temperature Range: -50 - 150°C
- Intermittent Temperature: -55 - 165°C
Usage Parameters
- Working Time: 1.5 h
- Mix Ratio by Volume: 5:1
- Mix Ratio by Weight: 10:1
Uncured Properties
- Mixed Density: 1.7 g/mL
- Density:
- A: 1.9 g/mL
- B: 0.9 g/mL
- Viscosity @ 25°C:
- A: 56 Pa·s
- B: 2.4 Pa·s
- Mixed: 10 Pa·s