Flexible Dual-Component Epoxy Potting & Encapsulating Compound, Black, (2) 1.7 Liter Pails

Due to its very low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

832FX is the best flexible epoxy with a convenient 1:1 volume mix ratio, which makes it compatible with most dispensing equipment. It can be cured at room temperature or higher.

Cured Properties

• Resistivity: 5.8 x 10¹² Ω·cm
• Breakdown Voltage: 36,300 V
• Dielectric Strength: 370 V/mil
• Dissipation Factor @ 1 MHz: 0.05
• Dielectric Constant @ 1 MHz: 3.1
• Hardness: 88 A
• Tensile Strength: 9.6 N/mm²
• Lap Shear:
  • Stainless Steel: 2.5 N/mm²
  • Aluminum: 3.4 N/mm²
• Glass Transition Temperature (T_g): 8.8°C
• CTE Prior T_g: 114 ppm/°C
• CTE After T_g: 218 ppm/°C
• Thermal Conductivity @ 25°C: 0.3 W/(m·K)
• Service Temperature Range: -40 - 140°C
• Intermittent Temperature: -50 - 150°C

Usage Parameters

• Working Time: 2.5 h
• Mix Ratio by Volume: 1:1
• Mix Ratio by Weight: 1.22:1

Uncured Properties

• Mixed Density: 1.1 g/mL
• Density:
  • A: 1.1 g/mL
  • B: 1.0 g/mL
• Viscosity @ 25°C:
  • A: 0.8 Pa·s
  • B: 0.2 Pa·s
  • Mixed: 0.7 Pa·s