Thermally Conductive Dual-Component Epoxy Potting & Encapsulating Compound
832TC is a 2-part, black epoxy that offers extreme environmental, mechanical, and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
- Low exotherm
- Convenient 1A:1B volume mix ratio
- High compressive and tensile strength
- Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulating characteristics
- Extreme resistance to water and humidity
- Solvent-free
Código PAC | C100326 |
---|---|
Modelo del fabricante | 832TC |
Marca | MG Chemicals |
Cured Properties
- Resistivity: 8.2 x 1012Ω·cm
- Breakdown Voltage: 48,300 V
- Dielectric Strength: 386 V/mil
- Hardness: 81 D
- Tensile Strength: 23 N/mm2
- Compressive Strength: 87 N/mm2
- Lap Shear:
-
- Stainless Steel: 13 N/mm2
- Aluminum: 16 N/mm2
- Glass Transition Temperature (Tg): 50°C
- CTE Prior Tg: 142 ppm/°C
CTE After Tg: 114 ppm/°C - Thermal Conductivity @ 25°C: 0.7 W/(m·K)
- Service Temperature Range: -30 - 175°C
- Intermittent Temperature: 200°C
Usage Parameters
- Working Time: 2 h
- Mix Ratio by Volume: 1:1
- Mix Ratio by Weight: 1.1:1
Uncured Properties
- Mixed Density: 1.7 g/mL
- Density:
- A: 1.6 g/mL
- B: 1.6 g/mL
- Viscosity @ 25°C:
- A: 33 Pa·s
- B: 12 Pa·s
- Mixed: 27 Pa·s