MG Chemicals 832TC

Thermally Conductive Dual-Component Epoxy Potting & Encapsulating Compound

In Stock

832TC is a 2-part, black epoxy that offers extreme environmental, mechanical, and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

  • Low exotherm
  • Convenient 1A:1B volume mix ratio
  • High compressive and tensile strength
  • Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
  • Excellent electrical insulating characteristics
  • Extreme resistance to water and humidity
  • Solvent-free
Tan bajo como USD 89.95

Documentos técnicos

Más información
Código PAC C100326
Modelo del fabricante 832TC
Marca MG Chemicals

Cured Properties

  • Resistivity: 8.2 x 1012Ω·cm
  • Breakdown Voltage: 48,300 V
  • Dielectric Strength: 386 V/mil
  • Hardness: 81 D
  • Tensile Strength: 23 N/mm2
  • Compressive Strength: 87 N/mm2
  • Lap Shear:
    • Stainless Steel: 13 N/mm2
    • Aluminum: 16 N/mm2
  • Glass Transition Temperature (Tg): 50°C
  • CTE Prior Tg: 142 ppm/°C
    CTE After Tg: 114 ppm/°C
  • Thermal Conductivity @ 25°C: 0.7 W/(m·K)
  • Service Temperature Range: -30 - 175°C
  • Intermittent Temperature: 200°C

Usage Parameters

  • Working Time: 2 h
  • Mix Ratio by Volume: 1:1
  • Mix Ratio by Weight: 1.1:1

Uncured Properties

  • Mixed Density: 1.7 g/mL
  • Density:
    • A: 1.6 g/mL
    • B: 1.6 g/mL
  • Viscosity @ 25°C:
    • A: 33 Pa·s
    • B: 12 Pa·s
    • Mixed: 27 Pa·s
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