High-Temperature Dual-Component Epoxy Potting & Encapsulating Compound, Black, (3) 2.3 Liter Cans

This product is designed for high-temperature applications and is especially useful when extreme physical strength and chemical resistance are required. This high-temperature epoxy resin can be cured at room temperature or higher.

Cured Properties

• Resistivity: 1.0 x 10¹³ Ω·cm
• Breakdown Voltage: >50,000 V
• Dielectric Strength: 470 V/mil
• Dissipation Factor: @ 1 MHz: 0.01
• Dielectric Constant @ 1 MHz: 2.8
• Hardness: 87 D
• Tensile Strength: 48 N/mm²
• Compressive Strength: 132 N/mm²
• Lap Shear:
  • Stainless Steel: 15 N/mm²
  • Aluminum: 7.4 N/mm²
• Glass Transition Temperature (T_g): 89°C
• CTE Prior T_g: 86 ppm/°C
• CTE After T_g: 152 ppm/°C
• Thermal Conductivity @ 25°C: 0.3 W/(m·K)
• Service Temperature Range: -40 - 225°C
• Intermittent Temperature: 250°C

Usage Parameters

• Working Time: 1 h
• Mix Ratio by Volume: 1.6:1
• Mix Ratio by Weight: 2:1

Uncured Properties

• Mixed Density: 1.1 g/mL
• Density:
  • A: 1.2 g/mL
  • B: 1.0 g/mL
• Viscosity @ 25°C:
  • A: 46 Pa·s
  • B: 6.6 Pa·s
  • Mixed: 22 Pa·s