Permabond

UV7141 Ceramic, Glass, & Metal Bonding UV-Curable Adhesive, Clear

In Stock

Permabond® UV7141 is a UV-curable adhesive with a secondary anaerobic cure mechanism. This makes it ideal for bonding materials such as ceramic-coated glass, mirrors, etc. where UV light cannot penetrate to provide a full cure in shadow areas. This dual cure mechanism helps speed up production rates. The UV cure tacks the components in place in seconds, reducing the need for jigging. The bulk of the adhesive then cures more slowly to produce optimum performance.

Cures in shadow areas
High shear strength
Excellent environmental resistance
100% solids, no solvents
Excellent adhesion to metal and glass

Tan bajo como USD 297.33

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Documentos técnicos

Product Info & TDS Sheets

Permabond UV7141 Technical Data Sheet

Detalles

Más información
Código PAC	C100366
Marca	Permabond
Tipo	Adhesivo UV

Más información

Physical Properties of Uncured Adhesive

Chemical composition: Methacrylate ester
Appearance: Colourless
Viscosity @ 25°C: 20 rpm: 1200-1700 mPa.s (cP)
Specific gravity: 1.1

Typical Curing Properties

Typical fixture time*
- Low power 4mW/cm² battery lamp: 5-20 secs
- LED 100mW/cm² lamp: 2-5 secs
- UV light guide 30W/cm²: 1-3 sec
Cure wavelength: 365-420 nm**
Anaerobic handling time: 30-60 minutes
Anaerobic working strength: 3-6 hours

*The cure time depends on the power of the UV lamp, its spectral output, the distance between the lamp and the components, and the transmission characteristics of the substrates.

**LED UV lamps have a narrow range of spectral output. It is important to check suitability with Permabond to match the LED lamp's peak wavelength with that of the adhesive's photoinitiator to ensure optimal adhesive cure.

Typical Performance of Cured Adhesive

Tensile strength (ASTM D-2095-69) steel to glass*: 14-17 N/mm² (2000 psi - 2500 psi)
Tensile strength (ISO37): 20 N/mm² (2900 psi)
Refractive index (cured): 1.490
Light transmittance: >98%
Elongation (ISO37): 20-50%
Hardness (ISO868): 60-70 Shore D
Dielectric strength: 10-12 KV/mm
Dielectric constant 1MHz@25°C: 4
Coefficient of thermal expansion: 85 x 10^-6mm/mm/°C