Tflex™ HP34 Thermal Gap Filler, 0.04" Thick, 5" x 3" Sheet
Tflex™ HP34 is a new development product within Laird's;s high-performance material portfolio. The high performing gap filler consists of graphite fibers expertly aligned to provide a very high bulk thermal conductivity. In addition to the high bulk Tc, Tflex™ HP34 is uniquely designed to maintain its thermal performance within an application under increased pressure. Best performance will occur at lower
pressures, 10-30 psi.
Features
- 34 W/mK bulk thermal conductivity
- Silicone-free formulation
- Maintains thermal performance under increased pressure
- Low contact resistance with mating surfaces
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
- Comprar 10 por USD 39.81 cada uno
- Comprar 50 por USD 34.94 cada uno
Documentos técnicos
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
5G Data Infrastructure | 5G Telecom | Data Infrastructure | Aerospace/Defense | Automotive | Datacom | Consumer Electronics | Servers
Applications
5G Antenna Radome | Wireless infrastructure |Routers | Servers | Instrumentation/Test and measure | Notebooks/Tablets/Portable Devices | Smart Home Devices | Telecom cabinets
Specifications
- Construction & Composition: Aligned Graphite
- Color: Grey
- Bulk Thermal Conductivity (W/mK): 34
- Density (g/cc): 2.3
- Hardness (Shore 00, 3 sec): 50
- Hardness (Shore 00, 30 sec): 50
- Temperature Range: -40-125°C
- Thermal Resistance (1.5mm) @ 30% deflection, 50°C: 0.589°C* cm2/W, (0.096 °C* in2/W)
- UL Flammability Rating: V-0
- Volume Resistivity: 10 Ohm-cm
*Due to the unique structure of this material, the surface texture and appearance may look different than traditional gap filler pads.
| SKU | I362476 |
|---|---|
| Modelo del fabricante | A18330-04 |
| Marca | Laird |
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