Permabond TA004360300C0101

TA436 High-Strength, High-Temperature Toughened Acrylic Adhesive, Green, 300ml Cartridge

Permabond® TA436 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics, and some thermoplastics. Permabond TA436 is a no-mix system that obtains handling strength 1-3 minutes when the adhesive and the Initiator 43 come in contact. Permabond TA436 offers high shear and impact-resistant bonds and improved high-temperature resistance.

  • Adhesion to a wide variety of substrates
  • Fast cure at room temperature
  • No mix application
  • High shear and peel strength
  • Good impact strength
  • Good chemical resistance
USD 1,428.67
(Case of 10)
  • Comprar 2 por USD 1,385.81 cada uno
  • Comprar 6 por USD 1,342.95 cada uno

Documentos técnicos

Product Info & TDS Sheets

Physical Properties of Uncured Adhesive

  • Chemical composition: Modified acrylic - solvent-free
  • Appearance: Transparent amber liquid
  • Viscosity @ 25°C:
    • 20rpm: 15,000 - 30,000 mPa.s (cP)
    • 2.5rpm: 45,000 - 70,000 mPa.s (cP)
  • Specific gravity (resin): 1.1

Typical Curing Properties

  • Ratio of use: 10: 1.5 approximately
  • Maximum gap fill: 0.5mm (0.02")
  • Fixture time (zinc) @23°C: No gap: 20-30 secs
  • Handling time (zinc) (0.3 N/mm2 shear strength is achieved) @23°C: No gap: 1-3 mins
  • Working strength (zinc) @23°C: No gap: 30-60 mins
  • Full cure @23°C: 24 hours

Typical Performance of Cured Adhesive

  • Shear strength (ISO4587)*
    • Mild steel: 15-25 N/mm2 (2200-3600 psi)
    • Zinc: 10-15 N/mm2 (1450-2200 psi)
  • Peel strength (aluminum) (ISO 4578): 45-65 N/25mm (10-14 PIW)
  • Tensile strength (ISO37): 25N/mm2 (3600 psi)
  • Impact strength (ASTM D-950) 10-15 kJ/m2
  • Coefficient of thermal expansion (ASTM D-696) 80 x 10-6 1/K
  • Thermal conductivity (ASTM C-177) 0.1 W/(m.K)
  • Dielectric constant (ASTM D-150) 4.6
  • Dielectric strength (ASTM D-149) 30-50 kV/mm
  • Volume resistivity (ASTM D-257) 2 x 1013 Ohm.cm

*Strength results will vary depending on the level of surface preparation and gap.

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