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HM165 High-Temperature Max. Gap Fill Retaining Compound, Green
Permabond® HM165 is a high-viscosity anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It is best suited for cylindrical parts and where high-temperature resistance is required. The high viscosity and thixotropic effect of the material allow for larger tolerances.
- Very high strength
- Easy to apply
- Improved fatigue life
- Excellent chemical resistance
- High-temperature resistance
Código PAC | C100345 |
---|---|
Marca | Permabond |
Tipo | Compuesto de retención |
Physical Properties of Uncured Adhesive
- Chemical composition: Acrylic
- Appearance: Green
- Viscosity @ 25°C:
- 2rpm: 25,000 mPa.s (cP)
- 20rpm: 10,000 mPa.s (cP)
- Specific Gravity: 1.1
- UV fluorescence: Yes
Typical Curing Properties
- Maximum gap fill: 0.3mm (0.01")
- Time taken to reach handling strength (M10 steel) @23°C: 15-20 minutes*
- Time taken to reach working strength (M10 steel) @23°C: 3-6 hours
- Full strength (M10 steel) @23°C: 24 hours
*Handling time at 23°C / 73°F. Copper and its alloys will make the adhesive cure more quickly, while oxidized or passivated surfaces (like stainless steel) will reduce cure speed. To reduce curing time, use Permabond activator A905 or ASC10 alternatively, increasing the curing temperature will reduce curing time.
Typical Performance of Cured Adhesive
- Torque strength (M10 steel ISO10964)
- Break 35 N·m (310 in.lb)
- Prevail 50 N·m (450 in.lb)
- Shear strength (steel collar & pin ISO10123): 20 MPa (2900 psi)
- Coefficient of thermal expansion: 90 x 10-6mm/mm/°C
- Dielectric strength: 11 kV/mm
- Thermal conductivity: 0.19 W/(m.K)