Permabond ES05690320C0101

ES569 Non-Sagging Single-Part Viscosity Epoxy, Black, 320ml Cartridge

Permabond® ES569 is a single-part heat-cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace mechanical fastening, soldering, brazing, or welding. ES569 has been designed to be non-sagging, allowing the product to be used in large gaps and on vertical surfaces. It is also ideal for bonding electronic components as it has high wet strength is non-stringing and produces an excellent drop profile as well as withstanding solder reflow processes.

Excellent adhesive strength
Excellent resistance to vibration
Easy to use - no mixing required
High shear and peel strength
High-temperature resistance
Good resistance to chemicals
Non-sag, thixotropic

USD 127.90

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Product Info & TDS Sheets

Permabond ES569 Technical Data Sheet

Detalles

Physical Properties of Uncured Adhesive

Chemical composition: Epoxy Resin
Appearance: Silver-grey
Viscosity @25°C: 100,000-300,000 mPa.s (cP)
Specific gravity: 1.5

Typical Curing Properties

Flow at high temperature: Free flow
Maximum gap fill: 0.5mm (0.02")
Cure speed (oven)*
- 130° C (266°F): 75 minutes
- 150°C (300°F): 60 minutes
- 170°C (338°F): 40 minutes
Cure speed (induction) <3 minutes

*Actual cure times will depend on the time it takes for the adhesive to reach this temperature - for example, large assemblies or a crowded oven will require longer to reach full cure. Alternative, quicker methods of curing include induction, hotplates, infrared lamps, and hot-air guns.

Physical Properties of Cured Adhesive

Shear strength* (ISO4587):
- Steel 27 - 41 N/mm² (4000 - 6000 psi)
- Aluminium 17 - 31 N/mm² (2500 - 4500 psi)
- Zinc 14 - 27 N/mm² (2000 - 4000 psi)
Shear strength steel to ferrite: >14 N/mm² (>2000 psi) Substrate failure
Impact Strength (ASTM D-950): 25-35 KJ/m²
Hardness (ISO868): 80-85 Shore D
E-modulus: 3.5 GPa
Elongation at break (DIN 53504): <3%
Coefficient of thermal expansion:
- 45 x 10^-6mm/mm/°C (below Tg)
- 160 x 10^-6mm/mm/°C (above Tg)
Thermal conductivity: 0.9 W/(m.K)
Glass transition temperature (Tg - DSC): 120°C (250°F)