ES562 Self-Leveling Single-Part Epoxy, White, 200ml Bottle

Physical Properties of Uncured Adhesive

• Chemical composition: Epoxy Resin
• Appearance: White
• Viscosity @ 25°C: 15,000 - 30,000 mPa.s (cP)
• Specific gravity: 1.2

Typical Curing Properties

• Flow at high-temperature: Free flow
• Maximum gap fill: 0.25mm (0.01")
• Cure speed (oven) *
  
  • 130° C (266°F): 60 minutes
  • 150°C (300°F): 45 minutes
  • 160°C (320°F): 20 minutes
• Cure speed (induction): <3 minutes

*Actual cure times will depend on the time it takes for the adhesive to reach this temperature - for example, large assemblies or a crowded oven will require longer to reach full cure. Alternative, quicker methods of curing include induction, hotplates, infrared lamps, and hot-air guns.

Physical Properties of Cured Adhesive

• Shear strength* (ISO4587):
  
  • Steel 20 - 35 MPa (3000 - 5000 psi)
  • Aluminium 14 - 27 MPa (2000 - 4000 psi)
  • Zinc 14 - 27 MPa (2000 - 4000 psi)
• Tensile strength (DIN53504): 40 N/mm² (5800 psi)
• Hardness (ISO868): 80-85 Shore D
• E-modulus: 2.1 GPa
• Elongation at break (DIN53504): <3%
• Coefficient of thermal expansion:
  
  • 50 x 10^-6mm/mm/°C (below Tg)
  • 165 x 10^-6mm/mm/°C (above Tg)
• Thermal conductivity: 0.25 W/(m.K)
• Glass transition temperature (Tg - DSC): 115°C (240°F)
• Water absorption (ISO62): <0.5% (at room temperature)

*Strength results will vary depending on the level of surface preparation and gap.