Permabond

940 Low Odor, Low Bloom Wicking Grade Cyanoacrylate Adhesive, Clear

In Stock

Permabond® 940 is a low-odor, non-fogging, non-frosting alkoxy ethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bond lines, common with other cyanoacrylate adhesives on hot and humid days, is eliminated. The elimination of fogging improves the production rate of acceptable parts as well as their appearance. The adhesive is very stable and will provide optimum performance for one year when refrigerated.

  • Low odour for improved worker comfort
  • Non-frosting -good aesthetic appearance
  • Ease of use - no mixing or heat cure
  • Bonds most materials
  • 100% reactive, no solvents
Tan bajo como USD 39.12

Documentos técnicos

Product Info & TDS Sheets
Más información
Código PAC C100389
Marca Permabond
Tipo Cianoacrilato

Physical Properties of Uncured Adhesive

  • Chemical composition: Alkoxyethyl cyanoacrylate
  • Appearance: Colourless
  • Viscosity @ 25°C: 3-10 mPa.s (cP)
  • Specific gravity: 1.1

Typical Curing Properties

  • Maximum gap fill: 0.05mm (0.002")
  • Fixture/handling time* (0.3 N/mm2 shear strength is achieved)
    • 10-15 seconds (PVC)
    • 10-15 seconds (Phenolic resin)
    • 10-15 seconds (ABS)
    • 2-5 seconds (Neoprene / NBR)
    • 10-15 seconds (Steel)
    • 10-15 seconds (Aluminium)
    • 30-40 seconds (Zinc)
  • Full strength 24 hours

*Handling times can be affected by temperature, humidity, and specific surfaces being bonded. Larger gaps or acidic surfaces will also reduce cure speed but this can be overcome by the use of Permabond C Surface Activator (CSA) or Permabond QFS 16.

Typical Performance of Cured Adhesive

  • Shear strength* (ISO4587):
    • Steel 16-20 N/mm2 (2300-2900psi)
    • Aluminium 8-9 N/mm2 (1200-1300psi)
    • Zinc 8 N/mm2 (1200psi)
    • ABS >6 N/mm2 (900psi) SF**
    • PC >5 N/mm2 (700psi) SF**
    • Phenolic 4 N/mm2 (600psi)
  • Impact strength (ASTM D-950): 3-5 kJ/m2 (1.4-2.4 ft-lb/in2)
  • Dielectric Strength (DIN 53481): 25 kV/mm
  • Dielectric Constant @ 1MHz (DIN 53483): 3
  • Coefficient of thermal expansion: 90 x 10-6mm/mm/°C
  • Coefficient of thermal conductivity: 0.1 W/(m.K)
  • Hardness (ISO868): 85 Shore D

*Strength results will vary depending on the level of surface preparation and gap.
**SF = Substrate failure

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