Kester TSF-6592LV

No-Clean Tacky Paste Flux

Ships HAZMAT

Compatible with Lead free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
Reflow-able with peak temperatures up 270 °C
Reflow-able in air nitrogen
Bright shinny soldered joints with clear residues
Aggressive flux on various substrates such as OSP-Cu Immersion finishes and ENIG
Clear non-tacky residues
High tack to minimize skewing of components
Low voiding
Stencil life of 8+ hours (process dependent)
Classified as ROL0 per J-STC-004A & J-STC-004B
Compliant to Bellcore GR-78-core
Shelf life 4 months from DOM when handled properly
Non-stocked Kester items may be subject to minimum orders.

Elementos de artículos agrupados
Nombre del producto	Cantidad
Kester 300303 No-Clean Tacky Paste Flux, 30g Syringe USD 53.52
Kester 300304 No-Clean Tacky Paste Flux, 100g Jar (Box of 10) USD 1,333.33
Kester 300305 No-Clean Tacky Paste Flux, 150g Cartridge (Box of 10) USD 2,000.00

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Documentos técnicos

Warranty

Kester Product Warranty

Product Info & TDS Sheets

Kester TSF-6592LV Flux Data Sheet

SDS/MSDS Sheets

Kester TSF-6592LV Flux Safety Data Sheet (SDS)

Detalles

Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.

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