No-Clean Tacky Paste Flux
- Compatible with Lead free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
- Reflow-able with peak temperatures up 270 °C
- Reflow-able in air nitrogen
- Bright shinny soldered joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu Immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
- Low voiding
- Stencil life of 8+ hours (process dependent)
- Classified as ROL0 per J-STC-004A & J-STC-004B
- Compliant to Bellcore GR-78-core
- Shelf life 4 months from DOM when handled properly
- Non-stocked Kester items may be subject to minimum orders.
Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.
| SKU | G100306 |
|---|---|
| Modelo del fabricante | TSF-6592LV |
| Marca | Kester |
| Tipo | No limpio |
| Notas | Sin plomo |
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Dispensadores de soldadura en pasta
Dispensación de pasta de soldadura de precisión para la reelaboración de componentes pequeños. -
Botellas dispensadoras
Compre botellas para dispensar flujo, disolventes y mucho más. -
Toallitas
Toallitas para cuartos limpios, laboratorios y microelectrónica y mucho más. -
Inspección visual
Microscopios y lupas para la inspección visual.
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