Kester NXG1

SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free No-Clean Solder Paste

Excellent wetting on a variety of metal
High Print speeds 25 to 200 mm/sec
Resistant to Slump
Shelf up to 8 months when refrigerated
Excellent printing Characteristics on 0.4 mm (16mil) pitch QFPs
Capable of 120 minuets break times in printing
Clean cosmetic aesthetics after reflow
Reflowable in air or nitrogen
J-STD-004B is classified ROL1.
Non-stocked Kester items may be subject to minimum orders.

Elementos de artículos agrupados
Nombre del producto	Cantidad
Kester 70-3213-0810 SAC305 Lead-Free No-Clean 88.5% T3 Solder Paste, 500g Jar (Box of 10) USD 1,241.08
Kester 70-3213-0811 SAC305 Lead-Free No-Clean 88.5% T3 Solder Paste, 600g Cartridge (Box of 10) USD 155.50

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Documentos técnicos

Product Info & TDS Sheets

Kester NXG1 Solder Paste Data Sheet

SDS/MSDS Sheets

Kester NXG1 Solder Paste Safety Data Sheet (SDS)

Warranty

Kester Product Warranty

Detalles

Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.

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