SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free No-Clean Solder Paste
- Excellent wetting on a variety of metal
- High Print speeds 25 to 200 mm/sec
- Resistant to Slump
- Shelf up to 8 months when refrigerated
- Excellent printing Characteristics on 0.4 mm (16mil) pitch QFPs
- Capable of 120 minuets break times in printing
- Clean cosmetic aesthetics after reflow
- Reflowable in air or nitrogen
- J-STD-004B is classified ROL1.
- Non-stocked Kester items may be subject to minimum orders.
Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.
| Vendido como | (Case of 10) |
|---|---|
| SKU | G100346 |
| Modelo del fabricante | NXG1 |
| Marca | Kester |
| Material | SAC305 |
| Tipo | No limpio |
| Notas | Sin plomo |
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