Kester NP560

SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free, Halogen-Free No-Clean Solder Paste

Classified as ROM0 under IPC JSTD-004B
Zero-halogen
Low voiding potential under QFNs
Excellent activity and printability
Vary low graping
Reflowable in air or nitrogen conditions
Wide reflow profile window with good solderability on various PCB surface finish
12 month shelf life refrigerated from Date of Manufacturing
Non-stocked Kester items may be subject to minimum orders.

Elementos de artículos agrupados
Nombre del producto	Cantidad
Kester 70-4825-0904 SAC305 Lead-Free No-Clean 86.5% T4 Solder Paste, 100g Syringe (Box of 25) USD 1,667.54
Kester 70-4823-0910 SAC305 Lead-Free No-Clean 88.3% T4 Solder Paste, 500g Jar (Box of 10) USD 1,316.75
Kester 70-4823-0911 SAC305 Lead-Free No-Clean 88.3% T4 Solder Paste, 600g Cartridge (Box of 10) USD 1,580.10

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Documentos técnicos

Product Info & TDS Sheets

Kester NP560 Solder Paste Data Sheet

SDS/MSDS Sheets

Kester NP560 Solder Paste Safety Data Sheet (SDS)

Warranty

Kester Product Warranty

Detalles

NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.

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