SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free No-Clean Solder Paste
- Lead-Free Joints that Closely resemble those achieved with SnPb solder paste
- Excellent solderability to a wide verity of surface metallization, including NiAu, ImSn and ImAg.
- High Print speeds up to 150 mm/sec
- Capable of 60 minute break times in printing.
- Stencil Life: 12+ hours (process dependent)
- Excellent printing characteristics to 16 and 20 mils pitch.
- Excellent print and reflow characteristics for 0201 applications.
- Stable tack life
- Classified as ROL1 PER J-STD-004. J-STD-004A & J-STD-004B
- Screen/Stencil Printing
- RoHs Compliance
- Shelf life is 4 months from date of manufacture and held at 0 to 10°C (32 to 50°F).
- Non-stocked Kester items may be subject to minimum orders.
Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading.
EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy.
The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).
Vendido como | (Case of 10) |
---|---|
SKU | G100324 |
Modelo del fabricante | EM907 |
Marca | Kester |
Material | SAC305 |
Tipo | No limpio |
Notas | Sin plomo |