Platinum Cure Dual Component Potting Encapsulant
Shin-Etsu's SES22533-60 A/B is a dual component, room-temperature cure, self-leveling potting encapsulant that cures to form a durable, flexible rubber to protect electronic components. SES22533-60 A/B exhibits excellent unprimed adhesion to most circuit board substrates, metals, plastics, glass, and ceramics.
- 1:1 mix ratio
- Room-temperature cure
- Self-leveling
- 2-part platinum cure potting gel
- Soft Shore 00 hardness of 60
- Fast snap time for quick assembly
- Superior vibration and stress reduction
| Código PAC | C100254 |
|---|---|
| Modelo del fabricante | SES22533-60-A/B |
| Marca | Shin-Etsu |
Typical Applications
- Protecting and electrically isolating electronic components
- Stress reduction
Notes
- Manufactured in Akron, OH
- If you like the X-832-299-AB but want a product that is less tacky, this product is perfect for you
- Has a 1:1 mix ration
- 9-minute snap time
- Has a black tint color
Typical Properties
- Type: Potting Encapsulant
- Cure Type: Addition
- One/Two Component: Two
- UL: HB
- Color: Transparent / Black
- Density @ 23°C (g/cm3): 0.97
- Viscosity A (cps): 520
- Viscosity B (cps): 290
- Mix Ratio by weight: 100:100
- Cure Conditions: 24hr @23°C
- Snap Time (min): 9
- Shore 00 Hardness: 60
- Usable Temperature Range: -40°C to +180°C
- Durometer @ 23°C 30min / 24h (Shore 00): 43/54
- AL Cohesive Failure (%): 100
Note: Values are not for specification purposes.
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