Tpcm™ 780SP Screen Printable Phase Change Material
Tpcm™ 780SP is a high-performance, inherently tacky, easy to rework screen printable phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today's demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount.
- Silicone-free for applications that are silicone sensitive Low total thermal resistance
- Inherently tacky and easy to use, no adhesive required
- High thermal reliability
- Ease of use for high volume manufacturing
- No mess due to thixotropic characteristics which prevent flow outside of interface
Industries
Consumer | Telecom/Datacom
Applications
Graphic Cards | Hard Disk Drives | IGBTs | Memory Modules | Notebooks/Tablets/Portable Devices | Servers | Smart Home Devices | Wireless infrastructure
Capabilities
Automated Packaging | Autoated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Specifications
- Construction: Filled Non-Silicone Paste
- Color: Gray
- *Density: 2.5 g/cc
- *Bulk Thermal Conductivity (W/m-K): 5.4
- Thermal Resistance (°C-cm2/W @70°C):
- 10 psi: 0.120
- 50 psi: 0.085
- Viscosity:
- 35 Pa-s @25°C
- 50,000 - 100,000cPs @25°C
- *Operating Temperature Range: -40°C - 125°C
- *Softening Temperature Range: ~45°C - 70°C
- *Minimum Bondline Thickness: 25µm
- *Dielectric Constant: 22.3@1KHz, 22.9@1MHz
- *Volume Resistivity: 1.5 x 1013Ω-cm
- *UL Recognition: V-0
*De-notes after solvent evaporation. Solvent evaporates within two hours at 60°C, or 8 hours at room temperature. After solvent evaporation the Tpcm™ 780SP will be firm and dry to the touch.
| SKU | G101074 |
|---|---|
| Marca | Laird |
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