Tgrease™ 300X Thermal Grease
Tgrease™ 300X is a silicone-based thermal grease for use in high-performance CPUs and GPUs. Tgrease™ 300X has a high thermal conductivity of 3.0 W/mK and superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability. Tgrease™ 300X has been formulated not to sag or drip with a high thixotropic index for ease of application and reliability.
- Low thermal resistance
- Excellent long term stability
- Resists pump out through novel gel technology
Industries
Automative | Industrial
Applications
Automotive Lighting | Automotive Powertrain/ECUs | Graphic Cards | Hard Disk Drives | IGBTs | Memory Modules | Notebooks/Tablets/Portable Devices | Servers | Smart Home Devices | Wireless Infrastructure
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Specifications
- Construction: Silicone Thermal Grease
- Color: Gray
- Density (g/cc): 2.7
- Bulk Thermal Conductivity: 3.0 W/m-K
- Thermal Resistance (°C cm2/W):
- 10 psi & 70°C: 0.20
- 50 psi & 70°C: 0.12
- Operating Temperature Range: -40°C - 150°C
- Viscosity (cP): 400,000
- Thixotropic Index: 3.35
- Minimum Bondline Thickness: 25µm
- Outgassing (TML): 0.07%
- Outgassing (CVCM): 0.01%
- Dielectric Constant: 28.3@1KHz / 31.8@1MHz
- Dissipation Factor: 0.014@1KHz / 0.005@1MHz
- Volume Resistivity: 1.0x1014 Ω-cm
| SKU | G101071 |
|---|---|
| Marca | Laird |
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