Tflex™ HD700 Series Silicone Based Thermal Gap Filler
Tflex™ HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
Features
- 5.0 W/mK thermal conductivity
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress
- Option for additional electrical isolation and tear resistance
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Documentos técnicos
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom
Applications
Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure
Specifications
- Construction & Composition: Ceramic filled silicone sheet
- Color: Pink
- Thermal Conductivity (W/mK): 5.0
- Density (g/cc): 3.3
- Hardness (Shore 00): 54
- Outgassing TML (weight %): 0.23
- Outgassing CVCM (weight %): 0.07
- Temperature Range: -50-200°C
- Rth@ 40 mils, 10 psi: 0.287°C-in2/W
- Dielectric Constant @ 1 MHz: 5.01
- UL Flammability Rating: V-0
- Volume Resistivity: 1.4 x 1014 Ohm-cm
| SKU | G100987 |
|---|---|
| Marca | Laird |
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