Tflex™ 600 Series Silicone Based Thermal Gap Filler
Tflex™ 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. Tflex™ 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex™ 600 is electrically insulating, stable from -45°C to 200°C and meets UL 94 V0 rating.
Features
- Very high compliance for low stress applications
- 3 W/mK thermal conductivity
- Naturally tacky, needs no further adhesive coating
Documentos técnicos
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom
Applications
Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure
Specifications
- Construction & Composition: Ceramic filled silicone sheet
- Color: Blue-Violet
- Thermal Conductivity (W/mK): 3.0
- Density (g/cc): 1.34
- Hardness (Shore 00): 51
- Outgassing TML (weight %): 0.65
- Outgassing CVCM (weight %): 0.21
- Temperature Range: -45-200°C
- Rth@ 40 mils, 10 psi, 50°C: 0.62°C-in2/W
- Dielectric Constant @ 10GHz: 4.0
- UL Flammability Rating: V-0
- Volume Resistivity: 2x1013 Ohm-cm
| SKU | G100984 |
|---|---|
| Marca | Laird |
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