Tflex™ 300 Series Silicone Based Thermal Gap Filler
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliance allows the material to "totally blanket" the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.
Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Features
- Extreme compliancy allows material to "totally blanket" components
- Thermal conductivity of 1.2 W/mK
- Low compression set enables the pad to be reused many times
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Documentos técnicos
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom
Applications
Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure
Specifications
- Construction & Composition: Ceramic filled silicone sheet
- Color: Light Green
- Thermal Conductivity (W/mK): 1.2
- Density (g/cc): 1.78
- Hardness (Shore 00): 51.4 (20-30 mil), 25.2 (40+ mil)
- Outgassing TML (weight %): 0.56
- Outgassing CVCM (weight %): 0.1
- Temperature Range: -40-160°C
- Rth@ 40 mils, 10 psi, 50°C: 0.98°C-in2/W
- Dielectric Constant @ 10GHz: 4.5
- UL Flammability Rating: V-0
- Volume Resistivity: 1013 Ohm-cm
| SKU | G100985 |
|---|---|
| Marca | Laird |
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