2011 Metal Bonding Thixotropic Gel Cyanoacrylate Adhesive, Clear
Permabond® 2011 is a thixotropic, fast-setting cyanoacrylate particularly suitable for use on vertical and porous substrates. This material can be used on metals, plastics, elastomers, ceramics, and wood. Cyanoacrylate adhesives are single-component adhesives that polymerize rapidly when pressed into a thin film between parts. The moisture adsorbed on the surface initiates the curing of the adhesive. Strong bonds are developed extremely fast and on a great variety of materials. These properties make Permabond cyanoacrylates the ideal adhesives for high-speed production lines.
- Thixotropic
- Surface insensitive
- Fast cure
- Easy to apply and dispense
- High-temperature resistance
- Maximum gap-filling capability
- Approved to CID A-A-3097 Type II Class 5
- NSF Approved: Non-food Compound Category Code S4 Reg. No 155298
Código PAC | C100394 |
---|---|
Marca | Permabond |
Tipo | Cianoacrilato |
Physical Properties of Uncured Adhesive
- Chemical composition: Ethyl cyanoacrylate
- Appearance: Colourless
- Viscosity @ 25°C: Gel
- Specific gravity: 1.1
Typical Curing Properties
- Maximum gap fill: 0.5mm (0.02")
- Fixture/handling time* (0.3 N/mm2 shear strength is achieved)
- 5-10 seconds (Steel)
- 5-10 seconds (Buna N Rubber)
- 5-10 seconds (Phenolic)
- Full strength 24 hours
*Handling times can be affected by temperature, humidity, and specific surfaces being bonded. Larger gaps or acidic surfaces will also reduce cure speed but this can be overcome by the use of Permabond C Surface Activator (CSA) or Permabond QFS 16.
Typical Performance of Cured Adhesive
- Shear strength* (ISO4587):
- Steel 20-24 N/mm2 (2900-3500 psi)
- Aluminium 8-9 N/mm2 (1200-1300 psi)
- Zinc 10 N/mm2 (1500 psi)
- ABS >8 N/mm2 (1200 psi) SF**
- PVC >10 N/mm2 (1450 psi) SF**
- PC >6 N/mm2 (900 psi) SF**
- Phenolic 14 N/mm2 (2000 psi)
- Impact strength (ASTM D-950): 3-5 kJ/m2 (1.4-2.4 ft-lb/in2)
- Dielectric Strength (DIN 53481): 25 kV/mm
- Dielectric Constant @ 1MHz (DIN 53483): 2.5
- Coefficient of thermal expansion: 90 x 10-6mm/mm/°C
- Coefficient of thermal conductivity: 0.1 W/(m.K)
- Hardness (ISO868): 85 Shore D
*Strength results will vary depending on the level of surface preparation and gap.
**SF = Substrate failure