Sn62/Pb36/Ag2 No-Clean Solder Paste
- Excellent solderability on difficult to solder to components i.e., PbAg
- High activity on all substrates, including OSPs
- Capable of 90 minuet break times in printing
- Excellent printing characteristics to 0.4 mm (16 mil) pitch with Type 3 Powder
- High print speeds to 150+ mm/sec
- Stable tack over 8+ hours
- Stencil life: 8+ hours (process dependent)
- Scrap is reduced due to less paste dry out
- Classified as ROL0 per IPC J-STD-004
- Shelf life 6 month from DOM, when refrigerated
- Non-stocked Kester items may be subject to minimum orders.
EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface mentalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning. EP256HA is classified as ROL0.
| Vendido como | (Case of 10) |
|---|---|
| SKU | G100329 |
| Modelo del fabricante | EP256HA |
| Marca | Kester |
| Material | Sn62/Pb36/Ag2 |
| Tipo | No limpio |
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