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Anti-Static High-Temperature Polyimide Tape, 108' Rolls

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  • Anti-static High Temp Polyimide Tape for higher temperature applications masking PCB Gold features for wave soldering and IR reflow ovens
  • 3" Core
  • Made in America
Tan bajo como USD 24.29

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Más información
Código PAC C100183
Marca Desco
ESD certificado
Propiedades ESD Antiestático
Longitud Rollo de 108'
Espesor 2.4 mil
Tipo Poliimida
  • Low Charging Polyimide Film (2.4 Mils Thick) with Polysiloxane Adhesive - Wescorp tape generates less 50 volts when unwound from roll (at 73°F, 45% RH average) making it safe to use around most ESD sensitive items*
  • Surface Resistance 1 x 108 to < 1 x 1011 ohms Tested per ANSI/ESD S11.11 - Meets dissipative limit requirements of packaging standard ANSI/ESD S541
  • Temperature Resistance to a Maximum of 572°F (300°C) for 10 Second Max - May be exposed to high temperatures for wave soldering and other applications without leaving residue when removed
  • Lead-Free RoHS Compliant

*All tapes will generate some amount of triboelectric charge when unwound from roll. Standard, non-ESD tapes typically generate more than 1000 volts when unwound from roll. If you require less voltage than 50 volts, a grounded tape dispenser or ionization is recommended when unrolling the tape.

Applications for High-Temp Polyimide Tape

  • Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
  • Thick conductive adhesive excellent for conformability to protect critical PCB features
  • Near zero voltage generation when tape unrolled from roll [at 50% relative humidity]
  • Near zero voltage generation when tape removed from PCB [at 50% relative humidity]
  • Masking off PCBs for IR reflow ovens

Specifications

  • Tape is wound on a plastic core
  • ESD protective symbol is marked on the product (located on the core of the roll) per ANSI/ESD S541
  • Marked with manufacture information per ANSI/ESD S541 for quality control purposes
  • Removal leaves little or no residue
  • Static charge generation during unwind and peel off stainless steel plate application is 5 volts @ 50% RH
  • 1.0 mil thick (0.001" or 0.0254 mm) Polyimide Film (DuPont Kapton® or equivalent)
  • 1.4 mil thick (0.0014" or 0.0356 mm) conductive polysiloxide adhesive
  • Adhesive surface resistance 1 x 102 to < 1 x 105 ohms per ANSI/ESD STM11.11
  • Film surface resistance 1 x 108 to < 1x 1011 ohms per ANSI/ESD STM11.11
  • Max Temperature 260°C (500°F)
  • For best results, apply to board using a rubber roller
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