Anti-Static High-Temperature Polyimide Tape, 108' Rolls
- Anti-static High Temp Polyimide Tape for higher temperature applications masking PCB Gold features for wave soldering and IR reflow ovens
- 3" Core
- Made in America
Código PAC | C100183 |
---|---|
Marca | Desco |
ESD certificado | Sí |
Propiedades ESD | Antiestático |
Longitud | Rollo de 108' |
Espesor | 2.4 mil |
Tipo | Poliimida |
- Low Charging Polyimide Film (2.4 Mils Thick) with Polysiloxane Adhesive - Wescorp tape generates less 50 volts when unwound from roll (at 73°F, 45% RH average) making it safe to use around most ESD sensitive items*
- Surface Resistance 1 x 108 to < 1 x 1011 ohms Tested per ANSI/ESD S11.11 - Meets dissipative limit requirements of packaging standard ANSI/ESD S541
- Temperature Resistance to a Maximum of 572°F (300°C) for 10 Second Max - May be exposed to high temperatures for wave soldering and other applications without leaving residue when removed
- Lead-Free RoHS Compliant
*All tapes will generate some amount of triboelectric charge when unwound from roll. Standard, non-ESD tapes typically generate more than 1000 volts when unwound from roll. If you require less voltage than 50 volts, a grounded tape dispenser or ionization is recommended when unrolling the tape.
Applications for High-Temp Polyimide Tape
- Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
- Thick conductive adhesive excellent for conformability to protect critical PCB features
- Near zero voltage generation when tape unrolled from roll [at 50% relative humidity]
- Near zero voltage generation when tape removed from PCB [at 50% relative humidity]
- Masking off PCBs for IR reflow ovens
Specifications
- Tape is wound on a plastic core
- ESD protective symbol is marked on the product (located on the core of the roll) per ANSI/ESD S541
- Marked with manufacture information per ANSI/ESD S541 for quality control purposes
- Removal leaves little or no residue
- Static charge generation during unwind and peel off stainless steel plate application is 5 volts @ 50% RH
- 1.0 mil thick (0.001" or 0.0254 mm) Polyimide Film (DuPont Kapton® or equivalent)
- 1.4 mil thick (0.0014" or 0.0356 mm) conductive polysiloxide adhesive
- Adhesive surface resistance 1 x 102 to < 1 x 105 ohms per ANSI/ESD STM11.11
- Film surface resistance 1 x 108 to < 1x 1011 ohms per ANSI/ESD STM11.11
- Max Temperature 260°C (500°F)
- For best results, apply to board using a rubber roller