SAC305 H10 Lead-Free, Halogen-Free No-Clean Solder Paste

H10 Zero Halogen No Clean Solder Paste was developed to be a high-performance paste with strong activity leaving minimal high SIR residues. H10 is capable of transfer efficiency >90% on area ratios of 0.50. H10 wetting performance eliminates NWO (HiP) defects and improves pad coverage on all surface finishes. AIM H10 reduces voiding on BGA, BTC, and LGA and improves electrochemical reliability on all low-stand-off devices.

• Halide/Halogen-Free
• Excellent Wetting
• Low BTC and BGA Voiding
• High Reliability
• Print Capability to 0.50 Area Ratio with T4
• REACH and RoHS Compliant