NC265LR No-Clean Liquid Flux

NC265LR is an alcohol-based no-clean liquid flux formulated to offer low-residue for lead-free and tin-lead wave soldering operations. NC265LR offers faster wetting for SN100C® and SAC alloys than previously formulated fluxes and is compatible with a broad range of lead-free and tin-lead solder alloys. NC265LR offers low post-process residues and has proven to reduce preventative maintenance requirements for spray fluxing applications. NC265LR is safe to be left on the circuit board after processing and uncleaned. NC265LR is extremely safe for rework, palletized wave soldering and point-to-point selective soldering. NC265LR is designed to be a no-clean, non-visible residue flux that can be cleaned if critical to the product application.

NC265LR is formulated for application via spray, brush, mist, or dip. For spraying, NC265LR is ready to use directly from its container, no thinning required. When spray fluxing, it is imperative that proper flux coverage and uniformity be achieved and maintained. A dry flux coating of 500-1500 micrograms per square inch is recommended as a starting point. When nitrogen sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than normal as a result of excess drying due to the extended length of the equipment.