Permabond

240 Max. Gap Fill & Flow Control Plastic Bonding Cyanoacrylate Adhesive, Clear

In Stock

Permabond® 240 is a high-viscosity product useful in large-gap applications. It is ideal for porous substrates. It is fast setting and suitable for use on plastics, rubber, and metals. Cyanoacrylate adhesives are single-component adhesives that polymerize rapidly when pressed into a thin film between parts. The moisture adsorbed on the surface initiates the curing of the adhesive. Strong bonds are developed extremely fast and on a great variety of materials. These properties make Permabond cyanoacrylates the ideal adhesives for high-speed production lines.

  • Rapid development of high-strength
  • Ease of use - no mixing or heat cure
  • Bonds most materials
  • 100% reactive, no solvents
  • Approved to MIL-A-46050C Type II Class 3
Tan bajo como USD 29.30

Documentos técnicos

Product Info & TDS Sheets
Más información
Código PAC C100372
Marca Permabond
Tipo Cianoacrilato

Physical Properties of Uncured Adhesive

  • Chemical composition: Ethyl cyanoacrylate
  • Appearance: Colourless
  • Viscosity @ 25°C: 1,200-2,500 mPa.s (cP)
  • Specific gravity: 1.1

Typical Curing Properties

  • Maximum gap fill: 0.4mm 0.017 in
  • Fixture/handling time* (0.3 N/mm2 shear strength is achieved)
    • 15-20 seconds (Steel)
    • 15-20 seconds (Buna N Rubber)
    • 15-20 seconds (Phenolic)
  • Full strength: 24 hours

*Handling times can be affected by temperature, humidity, and specific surfaces being bonded. Larger gaps or acidic surfaces will also reduce cure speed but this can be overcome by the use of Permabond C Surface Activator (CSA) or Permabond QFS 16.

Typical Performance of Cured Adhesive

  • Shear strength* (ISO4587)
    • Steel 21-25 N/mm2 (3000-3600psi)
    • Aluminium 8-9 N/mm2 (1200-1300psi)
    • Zinc 10 N/mm2 (1450psi)
    • ABS >8 N/mm2 (1200psi) SF**
    • PVC >11 N/mm2 (1600psi) SF**
    • PC >5 N/mm2 (700psi) SF**
    • Phenolic 14N/mm2 (2000psi)
  • Impact strength (ASTM D-950): 3-5 kJ/m2 (1.4-2.4 ft-lb/in2)
  • Dielectric constant @10kHz: 2.5
  • Dielectric strength: 25 kV/mm
  • Coefficient of thermal expansion: 90 x 10-6mm/mm/°C
  • Coefficient of thermal conductivity: 0.1 W/(m.K)
  • Hardness (ISO868): 85 Shore D

*Strength results will vary depending on the level of surface preparation and gap.
**SF = Substrate failure

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